Gate News message, April 27 — The HCL-Foxconn joint venture has selected Taiwan-based CTCI as the engineering, procurement, and construction (EPC) partner for its semiconductor assembly and testing facility in Uttar Pradesh, India. The project, valued at 37.1 billion rupees (approximately $394 million), will manufacture display driver chips for smartphones, laptops, automobiles, and personal computers.
CTCI, a Taiwan-based engineering contractor with extensive experience in complex industrial projects, has a longstanding partnership with Foxconn and is currently working on another Foxconn electronics plant near Bengaluru. The company previously managed a $6 billion petrochemical facility in Qatar, demonstrating its capability in large-scale, technology-intensive construction.
The Uttar Pradesh facility is an Outsourced Semiconductor Assembly and Test (OSAT) plant, focusing on back-end chip packaging rather than front-end fabrication. This marks the sixth factory approved under India’s Semiconductor Mission, part of the government’s broader strategy to build domestic chip manufacturing capacity and strengthen supply chain self-reliance.
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