IBM and Lam Research Collaborating to Advance Sub-1nm Logic Scaling

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IBM and Lam Research have signed a new five-year agreement to advance logic semiconductor manufacturing to the sub-1nm node. The collaboration focuses on materials development, advanced etch and deposition processes, and High-NA EUV lithography, combining IBM’s research capabilities with Lam Research’s process technologies. Their joint efforts aim to develop new materials and processes for complex device architectures, supporting continued logic scaling and improved performance for future semiconductor devices.

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